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Hi,
Are there some plans to integrate a device driver into the EGX300 for supporting the new Micrologic trip units for Masterpact that are connected over IFM/IFE? We have more and more installations with this configuration with sometimes already existing EGX300. For sure one can develop a device driver, but unfortunately there is the disadvantage that you can't see the status of the trip unit in this case and the format of the real time pages is different to the one of the standard devices.
Thanks
Daniel
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Hi Daniel/Magnus,
Sorry I missed this question.
As you may know, the EGX300 will be substituted by the Com'X 510 throughout this year. We do not have on the roadmap to add more functionality into the EGX300 at this time. Let me see if we can provide any other suggestions.
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Hello Daniel,
We have the same issue in Sweden. We are seeing some major customer dissatisfaction when they realize that our latest COM-solution for Masterpact doesn't work with the EGX300 w. latest F/W ... They expect a plug-and-play functionality, as usual!
Priority number one would be to have Masterpact with IFM + IO module for chassis management integrated in EGX300 web pages.
Regards // Magnus
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Hi Magnus,
Good to hear that also someone else has the same problem than us!
Unfortunately there is no answer on this question until today.
I totally agree with you. The only solution that I found is either to use the NSX driver instead of Masterpact, but then the energy values are wrong (this is the only difference between the "new" Masterpact and NSX) or then you can write a custom driver, but this one can't show the breaker status. So both are not ideal solutions.
please can you give us an answer on this request?
Thanks
Daniel
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I undestand that Com'X510 will replace the EGX300 range end of this year but we launched Enerlin'X IFE last year and we have to wait one year for having a real plug and play solution...I believe that we are not giving the right message to the market.
In addition we have the same problem on Com'X200 where the integration with a Masterpact/Compact with IFE have to be done with a custom device generator!!!
So in my opinion it's not a problem only linked to EGX300 but in general about the integration of Enerlin'X range inside the Com'X/EGX solution.
It's a real pity not to make the most of our complete portfolio to push the smart panel concept.
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Ciao Paolo.
Just a note..the Com'X 510 will substitute the EGX300 beginning this month in Countries where launched. The Com'X 200 also does support the IFE and Masterpact/Compact natively today. Can you explain the need a custom device for this?
One last note...We do plan to have one last EGX300 update, but keeping the update to a minimal (minor bug fixes). I have requested estimates from engineering to include the addition of IFE support...but there is no guarantee at this time. I will have more to share on this next week.
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Ciao James,
looking at this post it seems that Masterpact and Compact with IFE are not native inside the Com'X200/210..
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Hi James,
In my mind, we have a greater need for EGX300 support of Masterpact/Compact NS with IFM (Modbus RS485) and IO module for chassis management. The IFE is already on Ethernet/Modbus TCP and has web pages of its own.
We have a large installed base of EGX300's all over the world, and it is clear that many of these installations will be upgraded or expanded in the near future. The least we should do is ensure that it supports all the devices commercialized up until its own end of commercialization ...
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Understood. Just an update for everyone.
I met with the engineering team last week, and we plan in this last EGX300 release to add support for Masterpact/Compact in the IFE/IFM. We also plan to add Smartlink IP support. I have not discussed adding the I/O module with them, and I am not sure what this effort will be...so I will check.
I am awaiting a final estimate from the validation/verification team for the release date, but I am anticipating a June release.
Will this support give what is highly desired? What if we do not support the I/O Module?
James
FYI::
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Very good news - thanks James!
Before we had the chassis management (indication of connected - test - disconnected position) with the CCM module. This will be replaced by the IO module.
I understand that the almost infinite number of possibilities available with the free programming of the IO module will be hard to take into account, but at least the standard application no 1, chassis management, is needed.
// Magnus
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I agree with Magnus comments, the I/O module + IFM module replace the CCM module so for the cradle management and the possibility to wiew this with Micrologic in EGX300 webpage without the customer must "downgrade" the firmware in IFM is important.
Hope this can be inplemented in this upcoming firmware.
Anders
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Thanks James for working on integrating Act9 Smartlink Ethernet in EGX300 ! I'm sure plenty of countries will appreciate that !
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Tnx James for your help!
A last question: do you confirm me that also the configuration Masterpact/Compact NS (Micrologic E) + IFM (not IFE) + IO module will be supported with all the features that today are supported in Micrologic E+CCM (included the reset of min/max values)?
Can I tell to the Customer that before the 31st of July we will be able to provide him the updated firmware?
Roberto
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No problem.
Please check email for more context, but yes...this is what we plan to release. There is still testing to be completed, but we're feeling very good about the release.
Lastly..for the release date. We are aiming for end of July. The only thing that I'm aware of that could post-pone this is waiting for the translations to come back, so the testers can also test with languages...OR...if something was found during our testing that requires any development change.
Thanks,
James
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